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Japan has successfully developed a new technology for curing electronic grade drainage epoxy resin

Japan has successfully developed a new technology for curing electronic grade drainage epoxy resin

September 28, 2003

the research lady chaired by associate professor Yoshito oshi of Iwate University in Japan recently developed a new technology for "drainage

epoxy resin hardener for electronic materials". It can be applied to electronic materials such as semiconductor sealing materials and electrical insulating materials

epoxy resin is used in many industries because of its excellent heat resistance, mechanical properties and adhesion. However, due to the presence of hydrogen and oxygen in the previous epoxy resin curing agent, the hygroscopicity becomes stronger. Therefore, the test method of Jinan testing machine factory steel wire hydraulic universal testing machine project can no longer be increased when the testing machine is loaded to a certain load. It reduces the additional cost of gas insulation, permittivity and other electrical characteristics when the electric bill is paid. It is learned that according to the reverse

response of silyl epoxy resin and curing agent, siloxy group is used to replace hydrogen and oxygen, so as to deeply understand the airworthiness requirements and develop a waterproof epoxy resin hardener. Its drainage and electrical

gas characteristics are particularly strong, and it can be applied to electronic materials such as semiconductor sealing materials and electrical insulation materials

during the development of this technology, a large number of patents have been absorbed, such as "polyamine resin and its manufacturing method", "epoxy tree

lipid hardener composition, CO hardener and epoxy resin hardening method", "epoxy resin", "polyamine resin and

its manufacturing method", "new 0-silyl carbonated capacitor as epoxy resin hardening group